1. We’re expanding
We recently announced an expansion of our manufacturing capacity in Chengdu, China to support advanced packaging technologies for our innovative semiconductors.
2. We’re breaking ground
Last week, we also celebrated the grand opening of our seventh assembly/test (A/T) facility. It is a 358,000 square foot building acquired in December and has just been qualified to use some of the most advanced semiconductor packaging technology in the world.
3. We’re supporting education
We have contributed $0.5M RMB toward a new Hope School in Danling, Sichuan. This is our second TI Project Hope School in Sichuan since 2010. We have also built 20 Project Hope libraries and 50 multimedia classrooms across Sichuan. In the TI Hope Schools, TIers donate their time to teach to students, inspiring them about the world of electronics with the intriguing “TI Magic Electronic Course” by demonstrating cool applications of electronic science and technologies empowered by TI innovations.
4. We’re supporting our customers
We’ve been committed to our Chinese customers for decades. With today’s opening of this new A/T and bumping facility announced, TI now is able to provide better service and support to more than 10,000 Chinese customers in every step from design and manufacturing to sales, technical support and product distribution.
5. We’re innovating
Research and development (R&D) initiatives happening in China can be found in products and applications in markets across the globe. With four R&D centers in China, TI’s product lines and development teams are designing Analog and Embedded products for a broad range of applications, including automotive, industrial and appliances.
Want to learn more about us in China? Check out our press release.